Maya Heat Transfer Technologies Ltd.
Founded in 1982, MAYA HTT Ltd (MAYA Heat Transfer Technologies Ltd) is a leading supplier of advanced thermal and fluid flow analysis software, structural analysis software, mechanical vibration test data acquisition software and related training and consulting services in mechanical engineering.
MAYA HTT's software and services help thousands of engineers and scientists worldwide to optimize product design early in the product development process, enabling them to significantly improve product quality while reducing product development time and cost.
MAYA HTT’s TMG-Flow solver provides a powerful and comprehensive
solution to computational fluid dynamics (CFD) problems. Combined with
TMG-Thermal, it solves a wide range of multi-physics scenarios involving
strong coupling of fluid flow and heat transfer.
The printed circuit board (PCB) and flexible printed circuit (FPC) data
exchange and modeler product provides associative and bi-directional
data exchange between ECAD PCB and FPC layout software and Siemens PLM
Software digital product development applications. It works with the
majority of ECAD layout software products and automatically generates 3D
assembly and part CAD models of the PCB or FPC and components.
For companies making extensive use of numerical simulation in their
product engineering, significant benefits can be realized by adopting a
single, PLM-integrated CAD and CAE platform. While a single CAE platform
is ideal, some external CAE tools or in-house process algorithms may be
required, and a multi-CAE working environment may then be needed.
In October 2005, MTS Corporation decided to withdraw
from the noise and vibration (NVH) data acquisition software market.
MAYA HTT acquired the withdrawn MTS NVH, and other test software, as
well as hiring key MTS personnel.
acquisition, MAYA HTT entered into a strategic partnership with Brüel
& Kjær to continue the sales and support of I-deas Test and related software products for noise and vibration data acquisition and analysis.
Product Name: NX Nastran
Virtual Product Modeling
- Data, Document, Workflow & Process Management
NX Nastran is the standard for advanced system-level
analysis across a wide array of industries due to its unique
capabilities for system modeling and sub-structuring (superelements),
dynamic response analysis and solution customization.
MAYA HTT’s TMG-Thermal solver
provides a comprehensive heat transfer simulation package, which allows
fast and accurate solutions to complex thermal problems.
Using advanced finite difference control volume technology, TMG-Thermal
makes it easy to numerically simulate nonlinear and transient heat
transfer processes including coupled conduction, radiation, free and
forced convection, 1D duct flow hydaulic networks, and material phase
change. Combined with TMG-Flow, it solves a wide range of multi-physics problems involving strong coupling of fluid flow and heat transfer.
The complete TMG-Thermal heat transfer solver capabilities can be explicitly coupled to the TMG-Flow
CFD solver capabilities for simulation of strong thermo-fluid
interactions and conjugate heat transfer. This multi-physics coupling
capability is offered at no extra cost. No additional licenses are
required, other than for the thermal and CFD product module.